Used Mounting technology for sale (142)

Condition: reconditioned (used), Year of construction: 2006, Functionality: fully functional, Our Siplace X 3 - X 2 package (2 x) is for sale. Consisting of: 1 x Siplace X 3 (model 2005) B 111 = €24,900 (excluding VAT) 1 x Siplace X 2 (model 2006) B 348 = €24,900 (excluding VAT) 1 x Siplace X 2 (model 2006) B 251 = €24,900 (excluding VAT) The machines are preferably sold as a package (line), but can also be sold individually upon request. Priority is therefore given to buyers of the entire line. All three machines have been inspected in our specialist workshop and tested for complete functionality (video reference runs for each machine are available upon request). All machines have a valid MFU. The machines are sold with tables (without MTC). Cobevu Suwevaarcsrb The MTC feeder on machine B 348 can be converted to a standard X feeder upon request. Please see the photos (Excel list) for the technical data for each machine. We are happy to answer any further questions you may have about the systems. Location of the machines: Zollner Elektronik / Roding Warehouse / Buchenstraße 18-20 / 93426 Roding: Inspection possible by appointment. The stated net price is per machine and is negotiable.

Year of construction: 2019, Condition: used, Operational condition. Crsbvaaowcghysrcjb Ask for additional information!

Condition: ready for operation (used), Platinum thickness: 0.5-4.5mm, component height: top max. 16mm, bottom max. 30mm, components: Chip, MELF, SOT, SOIC, TSOP, PLCC, QFP, BGA, LCC, µBGA etc., Incremental axes X: 0.001mm, Y: 0.001mm, Z: 0.02mm, theta: 0.045°, connected load: 2500W, operating temperature: 18-30°C, control: microprocessor control with CAN interface, operated on PC with Windows® 7, vision system: ESI CorePlace®, automatic board alignment, complete component identification, inspection of solder pads, pin positions, component position, BGA ball count etc., weight: 700kg. On-site inspection is possible. Cjbvswb E Shsaarcerb

Condition: good (used), Year of construction: 2011, Functionality: fully functional, The BF-Comet is equipped with Saki's unique line-scan camera image acquisition concept and vector analysis and can be used for all inspections (SMD, THT), both before and after soldering. Due to the very short cycle times, the operator practically never has to wait. This makes Saki technology ideal for benchtop use. The high-precision line-scan camera forms the central unit of the Saki image acquisition concept. During image acquisition, the circuit board is moved in one axis under the stationary optical system. The line-scan camera records line by line, with each line being recorded four times, alternating with the different light sources. After a few seconds, the image of the entire circuit board is available for inspection and programming. Variable and constant illumination methods are essential for reliable image analysis. The Saki system includes three central, variable units: coaxial (top), offset (side), and low (low) light sources. Thanks to the line scan concept, every component, regardless of its location on the circuit board, is always at the same distance and angle to the respective illumination. This results in evenly illuminated images for evaluation. The so-called top light unit is a 100% coaxial light source, which is introduced into the vertical camera view by a half-mirror. This creates a shadow-free image for 2D viewing. This is especially important for reliable solder joint inspection and inspections between tall components. The MLT illumination provides a clear, color-coded display between tinned/soldered and non-tinned surfaces. Surfaces without tin or with poor wetting are displayed in red tones and can thus be reliably detected using color recognition algorithms. Crsbswbgwrovaarcsb Foreign objects such as "lost" components, solder balls, scratches, damage, etc. can be detected with Saki's ECD function with a little additional programming effort. Since the image of the entire circuit board is already available, this function only requires a few seconds of additional inspection time (computing time). Foreign Body Inspection - Automatic Library Creation. Saki's KPK function automatically creates a library for unrecognized/new components with a presence inspection tailored to the assembled components. - Automatic X/Y coordinate generation for THT solder joints. If the layout data (CAD) for the THT solder joints is missing, this function can be used to automatically generate a library using an unsoldered and a soldered circuit board. - Programming Wizard The software offers a wizard to guide the programmer through the entire programming process, from importing the CAD data, aligning the data, and assigning libraries.

Condition: good (used), Year of construction: 2011, Functionality: fully functional, Built in 2011 Nitro Chain conveyor Csbvaarsv A Ufzecerb 4 cooling zones 7 preheating zones 3 peak zones 3 ovens available

Condition: used, Year of construction: 2015, Vitronics Soltec myReflow 7038 SMD reflow soldering oven Year of construction 2015 Pin length: 5 mm Pin spacing: 19 mm 10 heating zones 4 cooling zones N2 pressure: 6 bar LP width: 50 mm - 508 mm Max. component height: 40 mm / 30 mm (top / bottom) Csbvaaeuhfm Ujrcsrb Transport height: 832 - 914 mm Width adjustment: electrical Software version: 4.0.6.b

Condition: used, Year of construction: 1998, short loader Csbvaarevvuu Nocsrb bar diameter 12-72 mm

Condition: used, Year of construction: 2023, The POWERFLOW ULTRA is the innovation in the wave soldering product portfolio of Ersa GmbH. This full-tunnel wave soldering machine meets current and future flexibility and throughput requirements. The machine is available with both frame and finger transport. Working widths from 330 to 610 mm (XXL version) are possible. It can also be used to solder server boards for 5G communication. Ask for additional information! Csbowcgf Sjvaarcorb

Condition: ready for operation (used), Components per hour: 480,000, field of view (FOV) dimensions: 61.1x44.9mm², PCB dimensions: 50-533x50-609mm, PCB thickness: 0.5-4mm, max. PCB weight: 3kg, clamping clearance for PCB clamping: 3mm, component clearance under the camera: 34mm, component clearance under the PCB: 60mm. Length: 1110mm, width: 1351mm, height: 1892mm, weight: 900kg. Without loader and unloader. On-site inspection is possible. Cjbowb E Sbevaarcorb

Condition: not inspected (used), Year of construction: 2007, Functionality: unexamined, MPM AccuFlex Stencil Printer Stencil Printer The MPM AccuFlex is an automatic stencil printer designed for medium-volume, high-product variety printing. Maximum PCB size: 584 mm x 508 mm (23" x 20") Minimum PCB size: 75 mm x 50 mm (3" x 2") PCB thickness: 0.8 mm to 5.0 mm Maximum PCB weight: 4.5 kg Maximum component height below the PCB: 15 mm Transport speed: Adjustable Transport height: 860 mm to 960 mm from floor Print speed: 5 mm/s to 200 mm/s Print area: 559 mm x 498 mm Stencil frame size: Standard 737 mm x 737 mm (29" x 29") 240 V AC, 50/60 Hz Compressed air supply: 0.63 MPa (6.3 bar) Dimensions (H x D x W): 1575 mm x 1448 mm x 1314 mm mm Weight: 700 kg Crsbvasv T T Dksarceb

Condition: good (used), Year of construction: 2012, Koh-Young 3D Inline SPI 8030-3 L Year of manufacture 2012 Gerber conversion software Easy-to-use software package with touchscreen operation SPC Plus software Measurements: Insufficient, excessive, or no solder paste Csbvjv Uyw Hsaarcerb Bridge formation Paste deformation Volume, height XY position Shadow-free measurement via 2-way projection 4 MPix high-speed camera, 20 µm XY resolution, 0.37 µm Z resolution Approx. 60 cm²/sec inspection speed Z-axis tracking SPC Plus software package PCB size max. 510 x 510 mm Automatic width adjustment SMEMA interface Transport height 950 +/- 50 mm QR code recognition 2D detection of bridges and smearing

Condition: excellent (used), Year of construction: 2012, 9 heating zones 2 cooling zones (1 setting) Center support Electric width adjustment (programmable) 5 mm link chain conveyor Flux capacitor Crebsv U Acxjvaarcjb Interface: SMEMA HC2 Controller

Condition: used, Year of construction: 2018, Operational condition machine! Total of 2 machines available 2014 and 2018 vintage. Crebvaaswcgd Usrceb Ask for additional information!

Condition: ready for operation (used), Cycle time: 1.16s/QFP with Area CCD camera, 0. 85s/chip with Closed Loop Electromechanical Alignment, optimal placement rate: 3125 on IPC 9850 with Area SCC & LCC cameras, 4200 on IPC 9850 with CLEA, nominal placement rate: 2500-3500cph (components per hour), processable component types: 0201-Chip, MELF, SOT, SOIC, TSOP, TNT, PLCC, QFP, BGA, µBGA, LCC, field size: 42x42mm, fine pitch: Up to 0.4mm (16 mil), Tool change station: 12 nozzle positions, Heads: single gantry with two independently controlled pipettes, Assembly accuracy (X/Y) 3σ: 50µ with Area CCD camera,100µ with Closed Loop Electromechanical Alignment, PCB dimensions (X/Y): 30-330x30-450mm, PCB alignment: fiducial detection by ESI CorrectPlace® incl. Teach-in for drill holes or unusual contours, loading and alignment time: approx. 2.8s, number of axes: 2, length: 1700mm, width: 1500mm, height: 2200mm, weight: 450kg without feeder. On-site inspection is possible. Crjbvowb E Snsaarcob

Condition: good (used), Year of construction: 2008, Functionality: fully functional, Year of manufacture 04/2008 400 mm working width Finger conveyor Lifting and lowering station Spray fluxer Dynamic preheating at the bottom Cobjv Ta Hlovaarcsrb Convection heating

Year of construction: 2023, Condition: used, Average placement speed: 1,9 s/component with a 400 mm pick&place cycle using radial components. Min. PCB size L x W: 55x55 mm Max. PCB size L x W: 580x400 mm, Max PCB length with 3-segmented conveyor: 480mm Operational machine!  Cjbvowcf Ursaarcerb Feeders also available of model RTF 60. Ask for additional information!

Year of construction: 2006, Condition: good (used), SEHO Powerwave 8440-LRT wave soldering system Crebvev Szg Rjaarcjb Year of manufacture 2006 400 mm working width Fluxer 1 convection heater 3 IR heaters Solder filling can be offered upon request

Condition: used, Year of construction: 2006, -Spray fluxer Cjbvaarjwcf Rajcorb -2x medium-wave preheating cassettes -1x dynamic preheater -1x bottom convection preheater -Dual wave with chip pre-nozzle + ERSA Power Wave - Cooling unit at the outfeed -Synchronous code reading system upstream of the soldering system -Roller buffer at the outfeed -Motor-driven infeed conveyor with chain Ask for additional information.

Year of construction: 2009, Condition: not inspected (used), Reflow oven in operational condition. R to L configuration with SMEMA. Csbvevfp Nmeaarcorb Ask for additional information!

Condition: used, Year of construction: 2017, Operational condition and maintained. Ask for additional information! Csbswbfr Usvaarcjrb

Condition: used, Year of construction: 2017, Operational condition and maintained. Crjbjwbfpmjvaarceb Ask for additional information!

Condition: used, Year of construction: 2008, Operational unit! Ask for additional information! Crsbvaajwbfl Iorceb

Year of construction: 2017, Condition: ready for operation (used), Machine in good working condition! Ask for additional information! Cjbvjv T T Agsaarcerb

Condition: used, Year of construction: 2011, Preheating: 4 zones at the bottom • Heating Section: 1,650 mm • Active Cooling Section: 800 mm (2-stage from above) • Chain Pin Transport System: 5 mm pin length with center support • Transport Speed: 0.2 - 2.0 m/min (Realistic for BF products: 0.5 - 0.6 m/min) • Working Width: 50 - 500 mm • Electronic Control: For width adjustment and center support • Clearance Height: +35 mm / 25 mm • Inlet & Outlet Length: 700 mm each • Condensate Management / Process Gas Cleaning in cooling zone • Automatic Chain Lubrication • ERSAsoft and EPOS Basic Module • Inline Compatible • SMEMA Compliant • Transport Height: 940 - 965 mm Crsbov Sy Rusvaarceb Available from end of Q2 2025. Ask for additional information!

Condition: used, Year of construction: 2013, Segment: Fluxer Storage space for flux canister under the fluxer Alcohol-based flux Segment: Preheating Medium-wave heating from below, convection from above Segment: Pre-warming 8 quartz radiators, controllable in groups of 4 Segment: Preheating + Divided Solder Pot Long-wave heating plate Solder nozzle with leaded solder, 1st section Solder pot with lead-free solder, 2nd section (out of operation) Cebvaarjv Sy Akocsrb Availability in end of Q2 2025. Ask for additinal information!