Wire bonderKulicke and Soffa
8030
Machine data
Price & Location
- Location:
- De Schutterij 15, 3905 PJ Veenendaal, Nederland
Details about the offer
- Listing ID:
- A22123833
- Update:
- 15.06.2026
Description
Based on the architecture of the 8000-series bonders, the typical specifications were approximately:
Parameter Typical 8000-Series Capability
Bonding method Thermosonic wire bonding
Wire types Gold (Au), Aluminum (Al) depending on configuration
Bond type Ball bonding or wedge bonding (model-dependent)
Guodpfezdgl Hex Abmsc
Positioning Vision-assisted X-Y motion control
Bonding area Typically 50–100 mm class work envelope
Applications IC packaging, hybrids, chip-on-board, microelectronics
Automation Programmable automatic bonding sequences
The listing was translated automatically. Translation errors are possible.
Seller
Last online: Today
Registered since: 2013
10 listings online
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