Inline 3D SPI 8030-3LKoh-Young
SPI 8030-3L
Inline 3D SPI 8030-3L
Koh-Young
SPI 8030-3L
Year of construction
2012
Condition
Used
Location
Stolberg 

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Machine data
- Machine type:
- Inline 3D SPI 8030-3L
- Manufacturer:
- Koh-Young
- Model:
- SPI 8030-3L
- Year of construction:
- 2012
- Condition:
- good (used)
Price & Location
- Location:
- Leimberg 22, 52222 Stolberg, Deutschland

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Details about the offer
- Listing ID:
- A20771472
- Update:
- 16.12.2025
Description
Gerber conversion software
Easy-to-use software package with touch screen operation
SPC Plus software
Measurement:
insufficient, excessive, or missing solder paste
bridging
paste deformations
volume, height
XY positions
shadow-free measurement via dual-path projections
4 MPix high-speed camera, 20µm XY resolution, 0.37µm Z resolution
approx. 60cm²/sec inspection speed
Z-axis tracking
SPC-Plus software package
Max. PCB size: 510x510mm
Hsdpox H Ryuefx Ag Dofr
automatic width adjustment
SMEMA interface
Transport height 950 +/- 50mm
QR code recognition
2D detection of bridges and smearing
The listing was translated automatically. Translation errors are possible.
Easy-to-use software package with touch screen operation
SPC Plus software
Measurement:
insufficient, excessive, or missing solder paste
bridging
paste deformations
volume, height
XY positions
shadow-free measurement via dual-path projections
4 MPix high-speed camera, 20µm XY resolution, 0.37µm Z resolution
approx. 60cm²/sec inspection speed
Z-axis tracking
SPC-Plus software package
Max. PCB size: 510x510mm
Hsdpox H Ryuefx Ag Dofr
automatic width adjustment
SMEMA interface
Transport height 950 +/- 50mm
QR code recognition
2D detection of bridges and smearing
The listing was translated automatically. Translation errors are possible.
Seller
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