Bond Alignment SystemEVB
620 NT
Bond Alignment System
EVB
620 NT
Bidding
€85,000
Year of construction
2022
Condition
Used
Location
Suhl 

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Machine data
- Machine type:
- Bond Alignment System
- Manufacturer:
- EVB
- Model:
- 620 NT
- Machine number:
- S220193
- Year of construction:
- 2022
- Condition:
- used
Price & Location
- Price:
- €85,000
- Auction start:
- 21.10.2025 at 11:00 o'clock
- Auction end:
- 26.11.2025 at 11:15 o'clock
- Location:
- Am Mittelrain 11, 98529 Suhl
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Details about the offer
- Listing ID:
- A20356320
- Reference number:
- 376/3
- Update:
- 23.10.2025
Description
Wafer alignment system, max. wafer size 150 mm, max. wafer thickness 4.4 mm, with optical alignment module, underside microscope and CCD camera, as well as rack unit. NOTE: The system is in like-new condition and has not yet been used in production!
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The listing was translated automatically. Translation errors are possible.
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The listing was translated automatically. Translation errors are possible.
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