Used Besi Esec Wire Bonder for sale (2,918)

Year of construction: 2014, condition: used, Used machinery. 3 of total available. Hodpfx Ajy R U Spja Eofi

Condition: used, This is an Orthodyne 20 wire bonder, used for precision electronics assembly. The device is equipped with a microscope for detailed inspection during operation. These machines are often used for ultrasonic bonding in the semiconductor industry. Hjdpfx Aaezi Ap Ds Eefi The Orthodyne Model 20 is a manual ultrasonic heavy-wire wedge bonder primarily used for connecting power semiconductors (power devices), hybrid circuits, and power electronics with aluminum wire. Key specifications Property Specification Bonding method Ultrasonic wedge bonding Wire material Aluminum Wire diameter 4–20 mil (≈ 102–508 µm), depending on configuration Commonly used wire sizes 5 mil, 10 mil, 12 mil, and 20 mil Maximum bonding force Up to 1000 grams Ultrasonic power Up to 550 (machine setting) Working area Vacuum chuck with approx. 75 mm working diameter Operation Manual, under microscope Microscope Stereo zoom optics, typically 7×–40× depending on the model Applications IGBT and MOSFET modules Power hybrids DCB substrates Ceramic substrates (Al₂O₃, AlN) Thick aluminum bond wires for high currents Features Suitable for large aluminum wires up to 20 mil. Special Larrison bonding tools reduce wire damage and heel cracking. Automatic wire cutting during the second bond. Optionally available with deep-access clamps and a video camera for improved positioning.

Year of construction: 2004, condition: excellent (used), Known K&S 8020 Specifications Specification Value Bonding type Automatic thermosonic ball bonder Wire material Gold wire (Au) Bond head Voice-coil direct-drive bond head Ultrasonic transducer 120 kHz unibody transducer with adaptive USG Vision system 20/20 vision system Camera Sony XC-75 CCD Bond pitch capability Sub-70 µm pitch kit available Bond area 2.0 × 2.3 in (≈ 50.8 × 58.4 mm) Optics Universal optics with increased depth of field Illumination LED Workholder 250-series heated manual workholder Power 208 V, 50/60 Hz Control Software-controlled automatic bonding programs Typical Process Capability The 8020 was developed to provide: Fine-pitch bonding Long, low wire loops Improved process control High throughput for leadframe and laminate packages Automated vision alignment and pattern recognition These capabilities were key selling points of the 8000 family. Applications Plastic IC packages SOIC, QFP, TSOP Memory devices ASICs Hfedozdgm Dspfx Aa Eei Hybrid microelectronics Chip-on-board assemblies Physical Characteristics Unfortunately, a complete factory datasheet with dimensions, weight, XY-table resolution, bond-force range, and supported wire diameters is not readily available in public archives. Most of the available information comes from listings of used equipment and K&S annual reports. If you need details such as: Bond force range (grams) Wire diameter range (e.g., 0.7–2.0 mil) XY positioning resolution Air requirements Maintenance manual Error codes or calibration procedures

Condition: used, The K&S 8030 was a wire bonder, likely a specialized or less common variant. Based on the architecture of the 8000-series bonders, the typical specifications were approximately: Parameter Typical 8000-Series Capability Bonding method Thermosonic wire bonding Wire types Gold (Au), Aluminum (Al) depending on configuration Bond type Ball bonding or wedge bonding (model-dependent) Positioning Vision-assisted X-Y motion control Bonding area Typically 50–100 mm class work envelope Applications IC packaging, hybrids, chip-on-board, microelectronics Automation Programmable automatic bonding sequences Hfsdpfx Ajzdgl Hja Eei

Condition: excellent (used), For sale is a professional Dr. TRESKY AG T-3000-FC3 station, manufactured by a renowned Swiss company. This is a high-quality laboratory device designed for the precise assembly and positioning of semiconductor structures (Die Bonding / Flip-Chip Assembly). It is used in research laboratories, as well as in the production of electronics, photonics, optoelectronics, and microelectronics. The T-3000-FC3 model is one of the most versatile platforms from Tresky and enables the execution of both basic and advanced assembly processes. Hfodpfxezi Upcj Aa Eoi Technical specifications: Manufacturer: Dr. TRESKY AG Model: T-3000-FC3 Country of manufacture: Switzerland Type: manual Die Bonder / Component Placer FC3 Bond Force Control controller Olympus SZ51 stereoscopic microscope Precision XY table Bond force control Vacuum and pneumatic system LED work lighting Documentation included Numerous working tips, holders, and accessories as shown in the photos Applications The device is used for: assembly of semiconductor devices (Die Bonding), Flip-Chip technology, assembly of MEMS components, production of photonics and optoelectronics, assembly of VCSEL lasers, assembly of sensors and hybrid circuits, research and development work and prototyping. Condition The device is sold with extensive equipment as shown in the photos: Olympus microscope, FC3 controller, documentation, drawers with accessories, set of tools and working tips, pneumatic components and accessories. The visual condition is very good. It is sold exactly in the configuration shown in the photos.

Condition: good (used), Year of construction: 2005, functionality: limited functionality, The FICO MMS-12-M is a Manual Molding System for the encapsulation (transfer molding) of semiconductors. It is a mechanically operated machine, primarily used for small series, development, and pilot production. Key specifications: Characteristic | Specification Type | Manual Molding System (MMS) Manufacturer | FICO (now part of Besi) Machine design | Mechanical Loading | Manual placement of lead frames Number of molds | 1 Hodpjzk Ak Refx Aa Eofi Capacity | 2 lead frames per cycle (12-position configuration) Application | Transfer molding of ICs, transistors, and other semiconductor packages Production | Development, prototypes, and small production runs Meaning of "12-M" According to FICO documentation: MMS = Manual Molding System 12 = machine with one mold suitable for two lead frames. M = mechanical design. Typical features: Manual input of lead frames. Heated transfer mold. Hydraulic or mechanical press for the transfer process (depending on the design). Temperature and process time control. Suitable for epoxy molding compounds (EMC). Developed for laboratories, R&D, and small production quantities.

Condition: good (used), Module converter, electronic module -Wire type: DSV 5421-10/220 -Module: 220 V/4 KVA/10 A -Dimensions: 275/275/H225 mm Hsdpfx Aaofcl H Is Esfi -Weight: 8.1 kg

Condition: good (used), Servo motor, electric motor, DC motor, stepper motor, stepper motor, stepping motor -Manufacturer: Scharmann, DC motor with tachometer dynamo and cooling fan -Engine: Type GLF 100/13 -Voltage: 170/200V -Power: 6.5 kW -Speed: 3000 rpm -Tachometer dynamo: Hübner TDP 0.2 T-4 60V 1000/max. 9000 rpm -technical Data: see photo of nameplate -Shaft: Ø 28 x 45 mm -Design: B5 -Dimensions: 640/250/H390 mm -Weight: 57 kg Hfedpfx Aajq Rxz Te Eoi

Condition: used, Module converter, electronic module -Wire type: DSV 5421-10/220 -Module: 220 V/4 KVA/10 A -with: controller BELIMO SGS -Dimensions: 275/275/H225 mm Hedpofcl H Usfx Aa Ejfi -Weight: 9.7 kg

Condition: ready for operation (used), Wire Electronic DSV 5431-25 / 380 - DSV 5431-25/380, serial number as per photo, used, normal signs of use, 100% functional, scope of delivery as per photos Hjdpfx Ajy S Nmdea Ejfi

Condition: ready for operation (used), Year of construction: 2012, functionality: fully functional, workpiece weight (max.): 4,100 kg, travel distance X-axis: 350 mm, travel distance Y-axis: 250 mm, travel distance Z-axis: 250 mm, overall weight: 2,640 kg, TECHNICAL DETAILS Hsdpfx Aezi D Uboa Esfi Workpiece weight (max.): 4,100 kg Travel range, X-axis: 350 mm Travel range, Y-axis: 250 mm Travel range, Z-axis: 250 mm Travel range, U-axis: ±45 mm Travel range, V-axis: ±45 mm Max. taper angle: ±10° Max. workpiece dimensions: 820 mm x 680 mm x 250 mm Table dimensions: 700 mm x 480 mm MACHINE DETAILS Machine weight: 2,640 kg

Condition: refurbished (used), Year of construction: 2018, functionality: fully functional, travel distance X-axis: 350 mm, travel distance Y-axis: 250 mm, travel distance Z-axis: 256 mm, GF AgieCharmilles CUT 2000S Year of manufacture: 2018 Travel ranges: X = 350 mm, Y = 250 mm, Z = 256 mm Travel ranges U/V axis: +/- 70 mm Maximum taper: 30° at a height of 100 mm Maximum workpiece dimensions: 750 x 550 x 250 mm Maximum workpiece weight: 200/450 kg Hodpfezlx A Sjx Aa Eofi AGIE IPG-V generator Achievable surface quality: Ra: 0.05 µm Available wire diameters: 0.05 – 0.30 mm incl. option KIT 50 Wire EDM machine with automatic wire threading With automatically lowerable tank (accessible from 2 sides) Incl. AGIEJOGGER handheld control box for convenient setup VISION 5 control system 15" LCD color screen, jog shuttle and mouse Incl. AGIESETUP 3D Incl. Conic-Plus option for improved taper Dimensions (length x width x height): 2095 x 1950 x 2232 mm Net weight: 3600 kg The machine will be completely overhauled and tested by us. We will gladly perform an individual test cut. We also offer commissioning and training on-site for this machine.

Condition: refurbished (used), Year of construction: 2013, functionality: fully functional, workpiece weight (max.): 800 kg, travel distance X-axis: 500 mm, travel distance Y-axis: 350 mm, travel distance Z-axis: 426 mm, workpiece height (max.): 420 mm, workpiece width (max.): 650 mm, workpiece length (max.): 1,050 mm, GF AgieCharmilles Progress VP3 Year of manufacture: 2013 Travel ranges: X = 500 mm, Y = 350 mm, Z = 426 mm Travel ranges U/V axis: +/- 70 mm Maximum taper: 30° at a height of 100 mm Maximum workpiece dimensions: 1050 x 650 x 420 mm Maximum workpiece weight: 400 (in the bath) / 800 (without the bath) kg Achievable surface quality: Ra: 0.20 µm Maximum cutting rate: 500 mm²/min Available wire diameters: 0.15 – 0.33 mm Wire EDM machine with automatic wire threading and re-threading after wire breakage With manual front door (accessible from one side) Includes AGIEJOGGER hand box for comfortable setup AGIE IPG-V generator AGIEVISION 5 control Hodpozlxraefx Aa Esfi Dimensions (length x width x height): 1940 x 2300 x 2600 mm Net weight: 3460 kg The machine will be cleaned and overhauled after receipt of your order. You will receive a 6-month warranty on all machine parts. We would also be happy to offer commissioning and training.

Condition: good (used), Year of construction: 2006, FOR SALE Mitsubishi FA20S Wire EDM Technical Specifications: - Model: FA20S (High-performance series) - Travel (X x Y x Z): 500 x 350 x 300 mm - U/V axis travel: ± 32 mm - Maximum part dimensions: 1050 x 800 x 295 mm - Maximum part weight: 1,500 kg - Maximum draft angle: ± 15° (over 100 mm of height) YEAR 2006 Included Equipment and Options: - Filtration system: TFA20SM dielectric fluid reservoir. - Automatic threading (AT) for optimized machining in masked time. - Mitsubishi numerical control with an intuitive interface. - Generator with anti-electrolysis technology for improved surface integrity. Key advantages: The machine offers excellent thermal stability and high reliability. Furthermore, spare parts and consumables (guides, filters) are readily available on the market. Condition: Used equipment in good overall condition. Do not hesitate to contact me for any further information or to discuss the price. Hodpezlrpfsfx Aa Ejfi

Condition: like new (used), Year of construction: 2013, FOR SALE Mitsubishi EA12VM ADVANCE Sink EDM machine - Brand: Mitsubishi Electric - Model: EA12VM ADVANCE - Type: Sink EDM (Die-Sinking EDM) - Year: approx. 2013 - Control: CNC Mitsubishi M700 Series with touchscreen interface Machining Capabilities - Axis travels: X: ~400 mm / Y: ~300 mm / Z: ~300 mm - Table dimensions: ~700 × 500 mm - Max. workpiece dimensions: approx. 800 × 550 × 250 mm - Max. workpiece weight: ~700 kg - Max. electrode weight: ~50 kg Hfodpezlrm Rjfx Aa Esi - C-axis: Equipped with a 3R/MACRO chuck for rotation and indexing Generator and Features - Power supply: FP80V (80 A) – FP120V (120 A) option available - Technologies: GM2/SC/PS circuits for optimizing speed and finish, Fuzzy Pro system - Connectivity: USB and Ethernet - Filtration: Dual-stage system with integrated chiller for dielectric temperature control Dimensions and Weight - Footprint: approx. 1750 × 2050 × 2335 mm - Total weight: approx. 3700 – 3800 kg

Condition: used, Year of construction: 1998, Sodick AM 35 CNC EDM Machine Model: AM 35 Year: 1998 Control: Neuro Fuzzy II 40: ‘X’ axis Travel: 350mm ‘Y’ axis Travel: 250mm ‘Z’ axis Travel: 250mm Tank Dimensions: W 790 x D 590 x H 320mm Max. electrode weight: 50 kg Hsdowqgh Aspfx Aa Eofi Max. Table Load: 550 kg With: Magnetic chuck 350 x 250mm

Condition: excellent (used), Year of construction: 2017, functionality: fully functional, Wire diameter range: 2,0 - 6,0 mm Wire feeding length: unlimited Hfsdpfoy Ehpwsx Aa Esi complete with an motorized wire decoiler WAFIOS H 3 table diamtere: 1.600 mm loading capacity: 1.500 Kg.

Condition: new, Year of construction: 2004, PVC-coated wire for making fence_ green coated wire with diam. 2,3 mm - 2,8 mm - 3,8 mm grey coated wire with diam. 2,5 mm - 2,8 mm - 4,2 mm Hfedpfxsx Ruhko Aa Eei

Condition: used, Year of construction: 1976, wire diameter: 3,0 - 5,5 mm Hodpskk Exjfx Aa Eefi nail length: 15 - 80 (100) mm output: 300 St./min.

Condition: excellent (used), functionality: fully functional, Year of construction: 2017, Wire diameter range: 2,0 - 10,0 mm Wire feeding length: unlimited No. of CNC-axes: 5 Hjdsy Ehrfjpfx Aa Eofi Bend-back clearance: max. 600 mm Weight: 2.400 Kg. *with chamfering unit* complete with an motorized wire decoiler table diamtere: 1.500 mm loading capacity: 1.500 Kg.

Condition: used, Year of construction: 2002, Wire erosion / EDM Travel distance X: 750 mm Travel distance Y :500 mm Travel distance Z: 400 mm max. workpiece size X: 1050 mm max. workpiece size Y: 750 mm max. workpiece size Z: 400 mm max. workpiece weight: 1500 kg Hodpfxsw Ei Sto Aa Eofi U / V axis: 770 x 520 mm generator: 60 Ampere Linear drives

Condition: used, Year of construction: 2013, Wire erosion / EDM Travel distance X: 600 mm Travel distance Y :400 mm Travel distance Z: 350 mm max. workpiece size X: 800 mm max. workpiece size Y: 570 mm max. workpiece size Z: 340 mm max. workpiece weight: 1000 kg table size X: 1050 mm table size Y: 710 mm with AWF ( Automatic Wire Feeding ) U / V axis: 150 x 150 mm submerged Hjdoy S Tgzepfx Aa Esfi CNC Control: SPW

Condition: used, Year of construction: 2000, Wire erosion / EDM Travel distance X: 520 mm Travel distance Y :370 mm Travel distance Z: 310 mm max. workpiece size X: 790 mm max. workpiece size Y: 730 mm Hedpsyk H Egofx Aa Ejfi max. workpiece size Z: 300 mm max. workpiece weight: 1000 kg table size X: 600 mm table size Y: 400 mm with AWF ( Automatic Wire Feeding ) U / V axis: 120 / 120 mm generator: 45 Ampere submerged cooling unit Perfect for precise EDM applications.

Condition: used, Year of construction: 2004, Wire erosion / EDM Travel distance X: 350 mm Travel distance Y :250 mm Travel distance Z: 256 mm max. workpiece size X: 750 mm Hedpfxjwf I Ime Aa Ejfi max. workpiece size Y: 550 mm max. workpiece size Z: 250 mm max. workpiece weight: 200 kg submerged cooling unit The machine has been serviced annually by the manufacturer.

Condition: used, Year of construction: 2003, Wire erosion / EDM Hedpfxjw Ekr Ij Aa Eefi Travel distance X: 350 mm Travel distance Y :250 mm Travel distance Z: 256 mm max. workpiece size X: 750 mm max. workpiece size Y: 550 mm max. workpiece size Z: 250 mm max. workpiece weight: 450 kg with AWF ( Automatic Wire Feeding )